Issued Patents All Time
Showing 26–50 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8866026 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Karan Kacker, Douglas O. Powell, David L. Questad, Sri M. Sri-Jayantha | 2014-10-21 |
| 8841209 | Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method | Sylvie Allard, Jean Audet, Kevin A. Dore, Sylvain Pharand | 2014-09-23 |
| 8587112 | Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack | Charles L. Arvin, Hai P. Longworth, Krystyna W. Semkow | 2013-11-19 |
| 8530345 | Electrical contact alignment posts | David J. West | 2013-09-10 |
| 8522430 | Clustered stacked vias for reliable electronic substrates | Karan Kacker, Douglas O. Powell, David L. Questad, Sri M. Sri-Jayantha | 2013-09-03 |
| 8415792 | Electrical contact alignment posts | David J. West | 2013-04-09 |
| 8258410 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Karan Kacker, Douglas O. Powell, David L. Questad, Sri M. Sri-Jayantha | 2012-09-04 |
| 8242593 | Clustered stacked vias for reliable electronic substrates | Karan Kacker, Douglas O. Powell, David L. Questad, Sri M. Sri-Jayantha | 2012-08-14 |
| 8232655 | Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack | Charles L. Arvin, Hai P. Longworth, Krystyna W. Semkow | 2012-07-31 |
| 7982475 | Structure and method for reliability evaluation of FCPBGA substrates for high power semiconductor packaging applications | Ronald Malfatt, Stefano S. Oggioni, Jamil A. Wakil | 2011-07-19 |
| 7868459 | Semiconductor package having non-aligned active vias | Jean Audet, Luc Guerin, David L. Questad | 2011-01-11 |
| 7312523 | Enhanced via structure for organic module performance | Jean Audet, Jon A. Casey, Luc Guerin, David L. Questad | 2007-12-25 |
| 7118837 | Photoimaged dielectric polymer and film, and circuit package containing the same | Vladimir Jakubek, Heike Appelt, Cory J. Ruud | 2006-10-10 |
| 6835533 | Photoimageable dielectric epoxy resin system film | Elizabeth Foster, Gary Johansson, Heike Marcello | 2004-12-28 |
| 6830875 | Forming a through hole in a photoimageable dielectric structure | Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich +2 more | 2004-12-14 |
| 6806033 | Photoimaged dielectric, its manufacture and use in electronics | Vladimir Jakubek, Heike Appelt, Cory J. Ruud | 2004-10-19 |
| 6706464 | Method of fabricating circuitized structures | Elizabeth Foster, Gary Johansson, Heike Marcello | 2004-03-16 |
| 6689543 | Laser ablatable material and its use | John S. Kresge, John M. Lauffer | 2004-02-10 |
| 6680440 | Circuitized structures produced by the methods of electroless plating | Gerald W. Jones, Heike Marcello, Voya R. Markovich | 2004-01-20 |
| 6576549 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-06-10 |
| 6576382 | Composition for photoimaging | Richard A. Day, Donald Herman Glatzel | 2003-06-10 |
| 6542379 | Circuitry with integrated passive components and method for producing | John M. Lauffer | 2003-04-01 |
| 6528218 | Method of fabricating circuitized structures | Elizabeth Foster, Gary Johansson, Heike Marcello | 2003-03-04 |
| 6519843 | Method of forming a chip carrier by joining a laminate layer and stiffener | John M. Lauffer, Heike Marcello | 2003-02-18 |
| 6521844 | Through hole in a photoimageable dielectric structure with wired and uncured dielectric | Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich +2 more | 2003-02-18 |