Issued Patents All Time
Showing 51–75 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6522014 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-02-18 |
| 6423905 | Printed wiring board with improved plated through hole fatigue life | William L. Brodsky, Kevin Knadle, John M. Lauffer, Douglas O. Powell | 2002-07-23 |
| 6391210 | Process for manufacturing a multi-layer circuit board | Bernd Karl Appelt, John M. Lauffer, Voya R. Markovich, Irving Memis | 2002-05-21 |
| 6361923 | Laser ablatable material and its use | John S. Kresge, John M. Lauffer | 2002-03-26 |
| 6290860 | Process for design and manufacture of fine line circuits on planarized thin film dielectrics and circuits manufactured thereby | Bernd Karl Appelt, John M. Lauffer, Voya R. Markovich, Irving Memis | 2001-09-18 |
| 6210862 | Composition for photoimaging | Richard A. Day, Donald Herman Glatzel | 2001-04-03 |
| 6195264 | Laminate substrate having joining layer of photoimageable material | John M. Lauffer, Heike Marcello | 2001-02-27 |
| 6180317 | Composition for photoimaging | Robert David Allen, Richard A. Day, Donald Herman Glatzel, William D. Hinsberg, John R. Mertz +1 more | 2001-01-30 |
| 6178093 | Information handling system with circuit assembly having holes filled with filler material | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, Kostas Papathomas | 2001-01-23 |
| 6138350 | Process for manufacturing a circuit board with filled holes | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, Kostas Papathomas | 2000-10-31 |
| 6127025 | Circuit board with wiring sealing filled holes | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, Kostas Papathomas | 2000-10-03 |
| 6121069 | Interconnect structure for joining a chip to a circuit card | Christina M. Boyko, Anthony P. Ingraham, Voya R. Markovich | 2000-09-19 |
| 6114019 | Circuit board assemblies having filled vias free from bleed-out | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, Kostas Papathomas | 2000-09-05 |
| 6080668 | Sequential build-up organic chip carrier and method of manufacture | John M. Lauffer | 2000-06-27 |
| 6022670 | Process for high resolution photoimageable dielectric | Donald Herman Glatzel | 2000-02-08 |
| 6000129 | Process for manufacturing a circuit with filled holes | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, Kostas Papathomas | 1999-12-14 |
| 5993945 | Process for high resolution photoimageable dielectric | Donald Herman Glatzel | 1999-11-30 |
| 5985760 | Method for manufacturing a high density electronic circuit assembly | John M. Lauffer, Donald Herman Glatzel | 1999-11-16 |
| 5955782 | Apparatus and process for improved die adhesion to organic chip carriers | Stephen J. Kosteva, David Michael Passante, William J. Rudik, Jonathan C. Whitcomb | 1999-09-21 |
| 5953623 | Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection | Christina M. Boyko, Anthony P. Ingraham, Voya R. Markovich | 1999-09-14 |
| 5876842 | Modular circuit package having vertically aligned power and signal cores | Thomas P. Duffy, Harold Kohn, Voya R. Markovich | 1999-03-02 |
| 5867898 | Method of manufacture multilayer circuit package | John M. Lauffer, James Jens Hansen | 1999-02-09 |
| 5822856 | Manufacturing circuit board assemblies having filled vias | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, Kostas Papathomas | 1998-10-20 |
| 5747223 | Composition for photoimaging | Robert David Allen, Richard A. Day, Donald Herman Glatzel, William D. Hinsberg, John R. Mertz +1 more | 1998-05-05 |
| 5670750 | Electric circuit card having a donut shaped land | John M. Lauffer, James Jens Hansen | 1997-09-23 |