Issued Patents All Time
Showing 401–425 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008446 | Advanced E-fuse structure with enhanced electromigration fuse element | Daniel C. Edelstein | 2018-06-26 |
| 10008563 | Dielectric with air gaps for use in semiconductor devices | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-06-26 |
| 10008558 | Advanced metal insulator metal capacitor | — | 2018-06-26 |
| 10008507 | Metal FinFET anti-fuse | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten, Miaomiao Wang | 2018-06-26 |
| 10002789 | High performance middle of line interconnects | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-06-19 |
| 9997460 | Formation of advanced interconnects | Daniel C. Edelstein | 2018-06-12 |
| 9997453 | Antifuse having comb-like top electrode | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-06-12 |
| 9997406 | Columnar interconnects and method of making them | Conal E. Murray | 2018-06-12 |
| 9991330 | Resistors with controlled resistivity | Daniel C. Edelstein | 2018-06-05 |
| 9991201 | Electrical antifuse including phase change material of tantalum | — | 2018-06-05 |
| 9985089 | Vertical MIM capacitor | — | 2018-05-29 |
| 9985088 | Metal resistors having nitridized metal surface layers with different nitrogen content | Daniel C. Edelstein | 2018-05-29 |
| 9984923 | Barrier layers in trenches and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Cornelius Brown Peethala, Michael Rizzolo | 2018-05-29 |
| 9972672 | Tunable resistor with curved resistor elements | Daniel C. Edelstein | 2018-05-15 |
| 9972671 | Metal resistors having varying resistivity | Daniel C. Edelstein | 2018-05-15 |
| 9966308 | Semiconductor device and method of forming the semiconductor device | Lawrence A. Clevenger, Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Junli Wang | 2018-05-08 |
| 9960240 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-05-01 |
| 9960078 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Koichi Motoyama, Wei Wang | 2018-05-01 |
| 9953950 | Nitride-enriched oxide-to-oxide 3D wafer bonding | Daniel C. Edelstein | 2018-04-24 |
| 9953916 | Critical dimension shrink through selective metal growth on metal hardmask sidewalls | Hsueh-Chung Chen, Hong He, Juntao Li, Yunpeng Yin | 2018-04-24 |
| 9953915 | Electrically conductive interconnect including via having increased contact surface area | Hsueh-Chung Chen, James J. Demarest, Sean Teehan | 2018-04-24 |
| 9953869 | Semiconductor device with reduced via resistance | Conal E. Murray | 2018-04-24 |
| 9953864 | Interconnect structure | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Wei Wang | 2018-04-24 |
| 9947655 | 3D bonded semiconductor structure with an embedded capacitor | Daniel C. Edelstein | 2018-04-17 |
| 9947580 | Interconnect structures with enhanced electromigration resistance | — | 2018-04-17 |