Issued Patents All Time
Showing 351–375 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217725 | Microstructure modulation for metal wafer-wafer bonding | — | 2019-02-26 |
| 10217664 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Koichi Motoyama, Wei Wang | 2019-02-26 |
| 10211280 | Method of forming tunable resistor with curved resistor elements | Daniel C. Edelstein | 2019-02-19 |
| 10211279 | Tunable resistor with curved resistor elements | Daniel C. Edelstein | 2019-02-19 |
| 10211153 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath | 2019-02-19 |
| 10211148 | Structural enhancement of Cu nanowires | Daniel C. Edelstein | 2019-02-19 |
| 10211101 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Koichi Motoyama, Wei Wang | 2019-02-19 |
| 10211095 | High performance middle of line interconnects | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2019-02-19 |
| 10204829 | Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers | Hari Prasad Amanapu, Cornelius Brown Peethala, Raghuveer R. Patlolla, Takeshi Nogami | 2019-02-12 |
| 10177092 | Formation of advanced interconnects | Daniel C. Edelstein | 2019-01-08 |
| 10177091 | Interconnect structure and method of forming | Andrew H. Simon | 2019-01-08 |
| 10177089 | Advanced E-fuse structure with controlled microstructure | Daniel C. Edelstein | 2019-01-08 |
| 10177088 | Electrical antifuse having solid core | — | 2019-01-08 |
| 10177030 | Cobalt contact and interconnect structures | Hari Prasad Amanapu, Raghuveer R. Patlolla, Cornelius Brown Peethala | 2019-01-08 |
| 10168075 | Critical dimension shrink through selective metal growth on metal hardmask sidewalls | Hsueh-Chung Chen, Hong He, Juntao Li, Yunpeng Yin | 2019-01-01 |
| 10170358 | Reducing contact resistance in vias for copper interconnects | Conal E. Murray | 2019-01-01 |
| 10170425 | Microstructure of metal interconnect layer | Hong He, Juntao Li, Junli Wang | 2019-01-01 |
| 10170424 | Cobalt first layer advanced metallization for interconnects | Daniel C. Edelstein | 2019-01-01 |
| 10170423 | Metal cap integration by local alloying | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2019-01-01 |
| 10163796 | Surface treatment for semiconductor structure | — | 2018-12-25 |
| 10163793 | Cobalt first layer advanced metallization for interconnects | Daniel C. Edelstein | 2018-12-25 |
| 10153202 | Neutral atom beam nitridation for copper interconnect | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2018-12-11 |
| 10141391 | Microstructure modulation for 3D bonded semiconductor containing an embedded resistor structure | — | 2018-11-27 |
| 10141392 | Microstructure modulation for 3D bonded semiconductor structure with an embedded capacitor | — | 2018-11-27 |
| 10141395 | High-K metal-insulator-metal capacitor and method of manufacturing the same | — | 2018-11-27 |