Issued Patents All Time
Showing 376–400 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134631 | Size-filtered multimetal structures | David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2018-11-20 |
| 10134675 | Cobalt top layer advanced metallization for interconnects | Daniel C. Edelstein | 2018-11-20 |
| 10128188 | High aspect ratio contact metallization without seams | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-11-13 |
| 10128186 | Simultaneous formation of liner and metal conductor | Daniel C. Edelstein | 2018-11-13 |
| 10128147 | Interconnect structure | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Wei Wang | 2018-11-13 |
| 10121740 | Advanced e-Fuse structure with hybrid metal controlled microstructure | Daniel C. Edelstein | 2018-11-06 |
| 10115670 | Formation of advanced interconnects including set of metal conductor structures in patterned dielectric layer | Daniel C. Edelstein | 2018-10-30 |
| 10115665 | Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-10-30 |
| 10109585 | Formation of advanced interconnects including a set of metal conductor structures in a patterned dielectric layer | Daniel C. Edelstein | 2018-10-23 |
| 10109586 | Semiconductor device interconnect structures formed by metal reflow process | Conal E. Murray | 2018-10-23 |
| 10096769 | Bottom electrode for MRAM applications | Prasad Bhosale, Raghuveer R. Patlolla, Michael Rizzolo | 2018-10-09 |
| 10090240 | Interconnect structure with capacitor element and related methods | Baozhen Li, Keith Kwong Hon Wong | 2018-10-02 |
| 10068846 | Surface nitridation in metal interconnects | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Wei Wang | 2018-09-04 |
| 10062605 | Via and chamfer control for advanced interconnects | Yann Mignot, Theodorus E. Standaert | 2018-08-28 |
| 10056330 | Electrical antifuse having airgap or solid core | — | 2018-08-21 |
| 10043747 | Vertical fuse structures | Juntao Li, Junli Wang | 2018-08-07 |
| 10037942 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-07-31 |
| 10037913 | Interconnect structures with enhanced electromigration resistance | — | 2018-07-31 |
| 10032855 | Advanced metal insulator metal capacitor | — | 2018-07-24 |
| 10032721 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-07-24 |
| 10032717 | Vertical fuse structures | Juntao Li, Junli Wang | 2018-07-24 |
| 10032716 | Advanced E-fuse structure with controlled microstructure | Daniel C. Edelstein | 2018-07-24 |
| 10020358 | Metal resistors having nitridized dielectric surface layers and nitridized metal surface layers | Daniel C. Edelstein | 2018-07-10 |
| 10020281 | Metal bonding pads for packaging applications | — | 2018-07-10 |
| 10020256 | Electronic fuse having an insulation layer | Chad M. Burke, Baozhen Li, Keith Kwong Hon Wong | 2018-07-10 |