Issued Patents All Time
Showing 426–450 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941204 | III-V compatible anti-fuses | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-04-10 |
| 9941203 | Method of making electrical antifuse | — | 2018-04-10 |
| 9941212 | Nitridized ruthenium layer for formation of cobalt interconnects | Daniel C. Edelstein | 2018-04-10 |
| 9941213 | Nitridized ruthenium layer for formation of cobalt interconnects | Daniel C. Edelstein | 2018-04-10 |
| 9941241 | Method for wafer-wafer bonding | Daniel C. Edelstein | 2018-04-10 |
| 9929091 | Vertical fuse structures | Juntao Li, Junli Wang | 2018-03-27 |
| 9929092 | Treating copper interconnects | Conal E. Murray | 2018-03-27 |
| 9911698 | Metal alloy capping layers for metallic interconnect structures | — | 2018-03-06 |
| 9911601 | Epitaxial silicon germanium fin formation using sacrificial silicon fin templates | Hong He, Juntao Li, Junli Wang | 2018-03-06 |
| 9905547 | Chip with light energy harvester | Chang-Hong Shen, Jia-Min Shieh, Wen-Hsien Huang, Tsung-Ta Wu, Tung-Ying Hsieh | 2018-02-27 |
| 9905459 | Neutral atom beam nitridation for copper interconnect | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2018-02-27 |
| 9899327 | Surface treatment for semiconductor structure | — | 2018-02-20 |
| 9899318 | Method for providing electrical antifuse including phase change material | — | 2018-02-20 |
| 9893144 | Methods for fabricating metal-insulator-metal capacitors | — | 2018-02-13 |
| 9893012 | Advanced e-fuse structure with hybrid metal controlled microstructure | Daniel C. Edelstein | 2018-02-13 |
| 9887160 | Multiple pre-clean processes for interconnect fabrication | Terry A. Spooner, Wei Wang | 2018-02-06 |
| 9881869 | Middle of the line integrated efuse in trench EPI structure | Hong He, Juntao Li, Junli Wang | 2018-01-30 |
| 9881798 | Metal cap integration by local alloying | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-01-30 |
| 9875959 | Forming a stacked capacitor | Conal E. Murray | 2018-01-23 |
| 9876075 | Method of forming dielectric with air gaps for use in semiconductor devices | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-01-23 |
| 9876068 | High-K metal-insulator-metal capacitor and method of manufacturing the same | — | 2018-01-23 |
| 9875966 | Method and structure of forming low resistance interconnects | — | 2018-01-23 |
| 9870993 | Simultaneous formation of liner and metal conductor | Daniel C. Edelstein | 2018-01-16 |
| 9865538 | Metallic blocking layer for reliable interconnects and contacts | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2018-01-09 |
| 9859155 | Cobalt first layer advanced metallization for interconnects | Daniel C. Edelstein | 2018-01-02 |