Issued Patents All Time
Showing 476–500 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786603 | Surface nitridation in metal interconnects | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Wei Wang | 2017-10-10 |
| 9786595 | Antifuse having comb-like top electrode | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2017-10-10 |
| 9786553 | Advanced BEOL interconnect structure containing uniform air gaps | — | 2017-10-10 |
| 9786605 | Advanced through substrate via metallization in three dimensional semiconductor integration | Daniel C. Edelstein | 2017-10-10 |
| 9786596 | Fuse formed from III-V aspect ratio structure | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2017-10-10 |
| 9773735 | Geometry control in advanced interconnect structures | — | 2017-09-26 |
| 9773737 | Advanced metallization for damage repair | Daniel C. Edelstein | 2017-09-26 |
| 9768118 | Contact having self-aligned air gap spacers | Juntao Li, Junli Wang | 2017-09-19 |
| 9768276 | Method and structure of forming FinFET electrical fuse structure | Hong He, Juntao Li, Yunpeng Yin | 2017-09-19 |
| 9761484 | Interconnect structure and fabrication thereof | — | 2017-09-12 |
| 9761529 | Advanced metallization for damage repair | Daniel C. Edelstein | 2017-09-12 |
| 9754883 | Hybrid metal interconnects with a bamboo grain microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2017-09-05 |
| 9754885 | Hybrid metal interconnects with a bamboo grain microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2017-09-05 |
| 9748169 | Treating copper interconnects | Conal E. Murray | 2017-08-29 |
| 9748173 | Hybrid interconnects and method of forming the same | Conal E. Murray | 2017-08-29 |
| 9741577 | Metal reflow for middle of line contacts | Juntao Li, Junli Wang | 2017-08-22 |
| 9735103 | Electrical antifuse having airgap or solid core | — | 2017-08-15 |
| 9735051 | Semiconductor device interconnect structures formed by metal reflow process | Conal E. Murray | 2017-08-15 |
| 9728399 | Simultaneous formation of liner and metal conductor | Daniel C. Edelstein | 2017-08-08 |
| 9721895 | Self-formed liner for interconnect structures | — | 2017-08-01 |
| 9722038 | Metal cap protection layer for gate and contact metallization | Praneet Adusumilli, Hemanth Jagannathan, Alexander Reznicek, Oscar van der Straten | 2017-08-01 |
| 9721788 | Simultaneous formation of liner and metal conductor | Daniel C. Edelstein | 2017-08-01 |
| 9721835 | Modulating microstructure in interconnects | Daniel C. Edelstein | 2017-08-01 |
| 9716063 | Cobalt top layer advanced metallization for interconnects | Daniel C. Edelstein | 2017-07-25 |
| 9716088 | 3D bonded semiconductor structure with an embedded capacitor | Daniel C. Edelstein | 2017-07-25 |