Issued Patents All Time
Showing 501–525 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716038 | Critical dimension shrink through selective metal growth on metal hardmask sidewalls | Hsueh-Chung Chen, Hong He, Juntao Li, Yunpeng Yin | 2017-07-25 |
| 9711400 | Interconnect structures with enhanced electromigration resistance | — | 2017-07-18 |
| 9711450 | Interconnect structures with enhanced electromigration resistance | — | 2017-07-18 |
| 9702042 | Method and apparatus for single chamber treatment | Daniel C. Edelstein | 2017-07-11 |
| 9698098 | Anti-fuse structure and method for manufacturing the same | Hong He, Juntao Li, Junli Wang | 2017-07-04 |
| 9698213 | Vertical MIM capacitor | — | 2017-07-04 |
| 9691659 | Via and chamfer control for advanced interconnects | Yann Mignot, Theodorus E. Standaert | 2017-06-27 |
| 9666527 | Middle of the line integrated eFuse in trench EPI structure | Hong He, Juntao Li, Junli Wang | 2017-05-30 |
| 9660030 | Replacement gate electrode with a self-aligned dielectric spacer | Shom Ponoth, Marc A. Bergendahl, Steven J. Holmes, David V. Horak, Charles W. Koburger, III | 2017-05-23 |
| 9659817 | Structure and process for W contacts | Daniel C. Edelstein, Baozhen Li | 2017-05-23 |
| 9653403 | Structure and process for W contacts | Daniel C. Edelstein, Baozhen Li | 2017-05-16 |
| 9647092 | Method and structure of forming FinFET electrical fuse structure | Hong He, Juntao Li, Yunpeng Yin | 2017-05-09 |
| 9646931 | Formation of liner and metal conductor | Daniel C. Edelstein | 2017-05-09 |
| 9640509 | Advanced metal-to-metal direct bonding | — | 2017-05-02 |
| 9627377 | Self-aligned dielectric isolation for FinFET devices | Marc A. Bergendahl, Kangguo Cheng, David V. Horak, Ali Khakifirooz, Shom Ponoth +4 more | 2017-04-18 |
| 9620479 | 3D bonded semiconductor structure with an embedded resistor | Daniel C. Edelstein | 2017-04-11 |
| 9620619 | Borderless contact structure | Veeraraghavan S. Basker, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2017-04-11 |
| 9614057 | Enriched, high mobility strained fin having bottom dielectric isolation | Bruce B. Doris, Hong He, Juntao Li, Junli Wang | 2017-04-04 |
| 9613899 | Epitaxial semiconductor fuse for FinFET structure | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2017-04-04 |
| 9613900 | Nanoscale interconnect structure | Stephan A. Cohen, Eric G. Liniger | 2017-04-04 |
| 9601432 | Advanced metallization for damage repair | Daniel C. Edelstein | 2017-03-21 |
| 9601386 | Fin isolation on a bulk wafer | Hong He, Juntao Li, Junli Wang | 2017-03-21 |
| 9595473 | Critical dimension shrink through selective metal growth on metal hardmask sidewalls | Hsueh-Chung Chen, Hong He, Juntao Li, Yunpeng Yin | 2017-03-14 |
| 9576901 | Contact area structure and method for manufacturing the same | Hsueh-Chung Chen, Su Chen Fan | 2017-02-21 |
| 9576880 | Dual damascene structure with liner | Baozhen Li | 2017-02-21 |