Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7897878 | Compliant penetrating packaging interconnect | Paul W. Coteus, Gareth G. Hougham | 2011-03-01 |
| 7784669 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, S. Jay Chey +4 more | 2010-08-31 |
| 7708909 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Paul A. Lauro, Jeffrey D. Gelorme | 2010-05-04 |
| 7703661 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, S. Jay Chey +4 more | 2010-04-27 |
| 7683493 | Intermetallic diffusion block device and method of manufacture | Charles L. Arvin, Carla A. Bailey, Harry D. Cox, Hua Gan, Hsichang Liu +3 more | 2010-03-23 |
| 7611923 | Method and apparatus for forming stacked die and substrate structures for increased packing density | Benjamin V. Fasano | 2009-11-03 |
| 7579069 | Negative coefficient of thermal expansion particles and method of forming the same | Gareth G. Hougham, Xiao Hu Liu, S. Jay Chey, James P. Doyle, Joseph Zinter +2 more | 2009-08-25 |
| 7449067 | Method and apparatus for filling vias | Paul S. Andry, Jon A. Casey, Raymond R. Horton, Chiraq S. Patel, Edmund J. Sprogis | 2008-11-11 |
| 7351360 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Paul A. Lauro, Jeffrey D. Gelorme | 2008-04-01 |
| 7294909 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more | 2007-11-13 |
| 7288474 | Suspension for filling via holes in silicon and method for making the same | Jon A. Casey | 2007-10-30 |
| 7276787 | Silicon chip carrier with conductive through-vias and method for fabricating same | Daniel C. Edelstein, Paul S. Andry, Leena Paivikki Buchwalter, Jon A. Casey, Sherif A. Goma +9 more | 2007-10-02 |
| 7250675 | Method and apparatus for forming stacked die and substrate structures for increased packing density | Benjamin V. Fasano | 2007-07-31 |
| 7202154 | Suspension for filling via holes in silicon and method for making the same | Jon A. Casey | 2007-04-10 |
| 6916670 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more | 2005-07-12 |
| 6823585 | Method of selective plating on a substrate | Mark J. LaPlante, Jon A. Casey, Thomas A. Wassick, David C. Long, Krystyna W. Semkow +8 more | 2004-11-30 |