Issued Patents All Time
Showing 201–225 of 234 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7422774 | Method for forming ultra low k films using electron beam | Yi Zheng, Li-Qun Xia, Eric Hollar, Kang Sub Yim | 2008-09-09 |
| 7200460 | Method of depositing low dielectric constant silicon carbide layers | Francimar Campana, Michael Chapin, Shankar Venkataraman | 2007-04-03 |
| 7189639 | Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide for semiconductor dielectric applications | Padmanabhan Krishnaraj, Michael S. Cox, Bruno Geoffrion | 2007-03-13 |
| 7176105 | Dielectric gap fill with oxide selectively deposited over silicon liner | Shankar Venkataraman | 2007-02-13 |
| 7151053 | Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications | Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more | 2006-12-19 |
| 7117064 | Method of depositing dielectric films | Li-Qun Xia, Dian Sugiarto, Ellie Yieh, Ping Xu, Francimar Campana-Schmitt +1 more | 2006-10-03 |
| 7087536 | Silicon oxide gapfill deposition using liquid precursors | Young Sung Lee | 2006-08-08 |
| 7060234 | Process and apparatus for abatement of by products generated from deposition processes and cleaning of deposition chambers | Himanshu Pokharna, Phong Le | 2006-06-13 |
| 7060330 | Method for forming ultra low k films using electron beam | Yi Zheng, Li-Qun Xia, Eric Hollar, Kang Sub Yim | 2006-06-13 |
| 7056560 | Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD) | Kang Sub Yim, Yi Zheng, Li-Qun Xia, Eric Hollar | 2006-06-06 |
| 7001850 | Method of depositing dielectric films | Li-Qun Xia, Dian Sugiarto, Ellie Yieh, Ping Xu, Francimar Campana-Schmitt +1 more | 2006-02-21 |
| 6902629 | Method for cleaning a process chamber | Yi Zheng, Vinita Singh, Chen-An Chen, Ju-Hyung Lee, Shankar Venkataraman | 2005-06-07 |
| 6897163 | Method for depositing a low dielectric constant film | Frederic Gaillard | 2005-05-24 |
| 6890850 | Method of depositing dielectric materials in damascene applications | Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more | 2005-05-10 |
| 6878620 | Side wall passivation films for damascene cu/low k electronic devices | Son V. Nguyen, Li-Qun Xia | 2005-04-12 |
| 6855484 | Method of depositing low dielectric constant silicon carbide layers | Francimar Campana, Michael Chapin, Shankar Venkataraman | 2005-02-15 |
| 6815373 | Use of cyclic siloxanes for hardness improvement of low k dielectric films | Vinita Singh, Yi Zheng, Lihua Li, Tzu-Fang Huang, Li-Qun Xia +1 more | 2004-11-09 |
| 6797643 | Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power | Juan Carlos Rocha-Alvarez, Maosheng Zhao, Ying Yu, Shankar Venkataraman, Li-Qun Xia | 2004-09-28 |
| 6764958 | Method of depositing dielectric films | Li-Qun Xia, Dian Sugiarto, Ellie Yieh, Ping Xu, Francimar Campana-Schmitt +1 more | 2004-07-20 |
| 6596343 | Method and apparatus for processing semiconductor substrates with hydroxyl radicals | Himanshu Pokharna, Shankar Chandran, Chen-An Chen, Francimar Campana, Ellie Yieh +1 more | 2003-07-22 |
| 6589888 | Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers | Li-Qun Xia, Ellie Yieh | 2003-07-08 |
| 6537733 | Method of depositing low dielectric constant silicon carbide layers | Francimar Campana, Michael Chapin, Shankar Venkataraman | 2003-03-25 |
| 6531398 | Method of depositing organosillicate layers | Frederic Gaillard, Li-Qun Xia, Ellie Yieh, Paul Fisher | 2003-03-11 |
| 6511924 | Method of forming a silicon oxide layer on a substrate | Kevin Mukai | 2003-01-28 |
| 6465366 | Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers | Li-Qun Xia, Ellie Yieh | 2002-10-15 |