Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400843 | Chamber configurations and processes for particle control | Fei Wu, Sungwon Ha, Ganesh Balasubramanian, Vinay Prabhakar | 2025-08-26 |
| 12347653 | Uniform in situ cleaning and deposition | Saket Rathi, Tuan Nguyen, Amit Kumar BANSAL, Yuxing Zhang, Badri Narayan Ramamurthi +2 more | 2025-07-01 |
| 12334384 | Methods and apparatus for minimizing substrate backside damage | Liangfa Hu, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Yoichi Suzuki | 2025-06-17 |
| 12234549 | Method of in situ ceramic coating deposition | Sarah Michelle Bobek, Ratsamee Limdulpaiboon, Kwangduk Douglas Lee | 2025-02-25 |
| 12217937 | Radio frequency source for inductively coupled and capacitively coupled plasmas in substrate processing chambers | Juan Carlos Rocha-Alvarez | 2025-02-04 |
| 12211728 | Electrostatic chuck design with improved chucking and arcing performance | Venkata Sharat Chandra Parimi, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Vinay Prabhakar | 2025-01-28 |
| 11948790 | Heater support kit for bevel etch chamber | Tuan Nguyen, Jeongmin Lee, Anjana M. Patel | 2024-04-02 |
| 11894228 | Treatments for controlling deposition defects | Sudha Rathi, Ganesh Balasubramanian, Nagarajan Rajagopalan, Prashanthi Para, Hiral D. Tailor | 2024-02-06 |
| 11875969 | Process chamber with reduced plasma arc | Fei Wu, Sungwon Ha, Vinay Prabhakar, Ganesh Balasubramanian | 2024-01-16 |
| 11756819 | Methods and apparatus for minimizing substrate backside damage | Liangfa Hu, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Yoichi Suzuki | 2023-09-12 |
| 11742185 | Uniform in situ cleaning and deposition | Saket Rathi, Tuan Nguyen, Amit Kumar BANSAL, Yuxing Zhang, Badri Narayan Ramamurthi +2 more | 2023-08-29 |
| 11699577 | Treatment for high-temperature cleans | Sarah Michelle Bobek, Ruiyun Huang, Amit Kumar BANSAL, Dong-Hyung LEE, Ganesh Balasubramanian +6 more | 2023-07-11 |
| 11682574 | Electrostatic chuck design with improved chucking and arcing performance | Venkata Sharat Chandra Parimi, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Vinay Prabhakar | 2023-06-20 |
| 11674222 | Method of in situ ceramic coating deposition | Sarah Michelle Bobek, Ratsamee Limdulpaiboon, Kwangduk Douglas Lee | 2023-06-13 |
| 11670492 | Chamber configurations and processes for particle control | Fei Wu, Sungwon Ha, Ganesh Balasubramanian, Vinay Prabhakar | 2023-06-06 |
| 11613808 | Clean processes for boron carbon film deposition | Jiheng Zhao, Prashant Kumar Kulshreshtha, Fang Ruan | 2023-03-28 |
| 11569072 | RF grounding configuration for pedestals | Satya THOKACHICHU, Edward P. Hammond, IV, Viren Kalsekar, Zheng John Ye, Vinay Prabhakar | 2023-01-31 |
| 11560623 | Methods of reducing chamber residues | Liangfa Hu, Prashant Kumar Kulshreshtha, Anjana M. Patel, Viren Kalsekar, Vinay Prabhakar +5 more | 2023-01-24 |
| 11515150 | Hardmask tuning by electrode adjustment | Michael Wenyoung Tsiang, Li-Qun Xia, Kevin Hsiao, Liangfa Hu, Yayun Cheng | 2022-11-29 |
| 11299805 | Plasma corrision resistive heater for high temperature processing | Ren-Guan Duan, Amit Kumar BANSAL, Jianhua Zhou, Juan Carlos Rocha-Alvarez | 2022-04-12 |
| 11133212 | High temperature electrostatic chuck | Jun Ma, Hyung Je Woo, Fei Wu, Jian Li | 2021-09-28 |
| 10971390 | Methods of minimizing wafer backside damage in semiconductor wafer processing | Liangfa Hu, Sudha Rathi, Ganesh Balasubramanian | 2021-04-06 |
| 10930475 | Graded in-situ charge trapping layers to enable electrostatic chucking and excellent particle performance for boron-doped carbon films | Prashant Kumar Kulshreshtha, Ziqing Duan, Zheng John Ye, Amit Kumar BANSAL | 2021-02-23 |
| 10923334 | Selective deposition of hardmask | Satya THOKACHICHU, Edward P. Hammond, IV, Viren Kalsekar, Zheng John Ye, Sarah Michelle Bobek +4 more | 2021-02-16 |
| 10916407 | Conditioning remote plasma source for enhanced performance having repeatable etch and deposition rates | Mohamad A. Ayoub, Jay D. Pinson, II, Juan Carlos Rocha-Alvarez | 2021-02-09 |