Issued Patents All Time
Showing 26–50 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7659170 | Method of increasing transistor drive current by recessing an isolation trench | Christoph Schwan, Martin Gerhardt, Markus Forseberg | 2010-02-09 |
| 7629211 | Field effect transistor and method of forming a field effect transistor | Sven Beyer, Thorsten Kammler, Rolf Stephan | 2009-12-08 |
| 7625802 | Semiconductor device having improved halo structures and a method of forming the halo structures of a semiconductor device | Thomas Feudel, Rolf Stephan | 2009-12-01 |
| 7579262 | Different embedded strain layers in PMOS and NMOS transistors and a method of forming the same | Jan Hoentschel, Andy Wei, Thorsten Kammler | 2009-08-25 |
| 7563731 | Field effect transistor having a stressed dielectric layer based on an enhanced device topography | Christoph Schwan, Kai Frohberg, Rolf Stephan | 2009-07-21 |
| 7556996 | Field effect transistor comprising a stressed channel region and method of forming the same | Christoph Schwan, Joe Bloomquist, Kai Frohberg | 2009-07-07 |
| 7547610 | Method of making a semiconductor device comprising isolation trenches inducing different types of strain | Christoph Schwan, Joe Bloomquist, Peter Javorka, Sven Beyer, Markus Forsberg +2 more | 2009-06-16 |
| 7510926 | Technique for providing stress sources in MOS transistors in close proximity to a channel region | Andy Wei, Thorsten Kammler, Jan Hoentschel | 2009-03-31 |
| 7442971 | Self-biasing transistor structure and an SRAM cell having less than six transistors | Frank Wirbeleit, Christian Hobert | 2008-10-28 |
| 7419867 | CMOS gate structure comprising predoped semiconductor gate material with improved uniformity of dopant distribution and method of forming the structure | Karsten Wieczorek, Thomas Feudel | 2008-09-02 |
| 7402497 | Transistor device having an increased threshold stability without drive current degradation | Andy Wei, Thorsten Kammler, Jan Hoentschel | 2008-07-22 |
| 7399663 | Embedded strain layer in thin SOI transistors and a method of forming the same | Jan Hoentschel, Andy Wei, Thorsten Kammler | 2008-07-15 |
| 7381624 | Technique for forming a substrate having crystalline semiconductor regions of different characteristics located above a crystalline bulk substrate | Andy Wei, Thorsten Kammler, Michael Raab | 2008-06-03 |
| 7329571 | Technique for providing multiple stress sources in NMOS and PMOS transistors | Jan Hoentschel, Andy Wei, Thorsten Kammler | 2008-02-12 |
| 7297994 | Semiconductor device having a retrograde dopant profile in a channel region | Karsten Wieczorek, Rolf Stephan | 2007-11-20 |
| 7238578 | Method of forming a semiconductor structure comprising transistor elements with differently stressed channel regions | Gert Burbach, Rolf Stephan, Karsten Wieczorek | 2007-07-03 |
| 7226859 | Method of forming different silicide portions on different silicon-containing regions in a semiconductor device | Karsten Wieczorek, Rolf Stephan | 2007-06-05 |
| 7217657 | Semiconductor device having different metal silicide portions and method for fabricating the semiconductor device | Karsten Wieczorek, Rolf Stephan | 2007-05-15 |
| 7208397 | Transistor having an asymmetric source/drain and halo implantation region and a method of forming the same | Thomas Feudel, Markus Lenski | 2007-04-24 |
| 7148145 | Semiconductor device having T-shaped gate structure comprising in situ sidewall spacers and method of forming the semiconductor device | Karsten Wieczorek, Rolf Stephan | 2006-12-12 |
| 7115464 | Semiconductor device having different metal-semiconductor portions formed in a semiconductor region and a method for fabricating the semiconductor device | Rolf Stephan, Karsten Wieczorek | 2006-10-03 |
| 7067410 | Method of forming a metal silicide | Karsten Wieczorek, Thorsten Kammler | 2006-06-27 |
| 7064074 | Technique for forming contacts for buried doped regions in a semiconductor device | Ralf van Bentum | 2006-06-20 |
| 7060549 | SRAM devices utilizing tensile-stressed strain films and methods for fabricating the same | Mark Craig, Karsten Wieczorek | 2006-06-13 |
| 7041583 | Method of removing features using an improved removal process in the fabrication of a semiconductor device | Karsten Wieczorek, Rolf Stephan | 2006-05-09 |