| 6756256 |
Method for preventing burnt fuse pad from further electrical connection |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2004-06-29 |
| 6743707 |
Bump fabrication process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more |
2004-06-01 |
| 6732912 |
Solder ball attaching process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2004-05-11 |
| 6723630 |
Solder ball fabrication process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more |
2004-04-20 |
| 6720244 |
Bump fabrication method |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2004-04-13 |
| 6716739 |
Bump manufacturing method |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more |
2004-04-06 |
| 6713320 |
Bumping process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2004-03-30 |
| 6714421 |
Flip chip package substrate |
Kun-Ching Chen, Chun-Chi Lee |
2004-03-30 |
| 6692581 |
Solder paste for fabricating bump |
Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen, Shyh-Ing Wu +5 more |
2004-02-17 |
| 6673711 |
Solder ball fabricating process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more |
2004-01-06 |
| 6664128 |
Bump fabrication process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +4 more |
2003-12-16 |
| 6617237 |
Lead-free bump fabrication process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2003-09-09 |
| 6403892 |
Coated means for connecting a chip and a card |
Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus +5 more |
2002-06-11 |
| 6224690 |
Flip-Chip interconnections using lead-free solders |
Panayotis Andricacos, Madhav Datta, Hariklia Deligianni, Wilma Jean Horkans, Sung Kwon Kang +4 more |
2001-05-01 |
| 5629564 |
Electroplated solder terminal |
Henry A. Nye, III, Jeffrey F. Roeder, Paul A. Totta |
1997-05-13 |
| 5546655 |
Method of applying flex tape protective coating onto a flex product |
Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus +5 more |
1996-08-20 |
| 5503286 |
Electroplated solder terminal |
Henry A. Nye, III, Jeffrey F. Roeder, Paul A. Totta |
1996-04-02 |
| 5433651 |
In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
Naftali E. Lustig, Katherine L. Saenger |
1995-07-18 |
| 5360946 |
Flex tape protective coating |
Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus +5 more |
1994-11-01 |
| 5322204 |
Electronic substrate multiple location conductor attachment technology |
Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer |
1994-06-21 |
| 5274913 |
Method of fabricating a reworkable module |
Kurt R. Grebe, Jack M. McCreary, Darbha Suryanarayana |
1994-01-04 |
| 5245136 |
Hermetic package for an electronic device |
Dudley A. Chance, David B. Goland |
1993-09-14 |
| 5233221 |
Electronic substrate multiple location conductor attachment technology |
Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer |
1993-08-03 |
| 5229328 |
Method for bonding dielectric mounted conductors to semiconductor chip contact pads |
Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer |
1993-07-20 |
| 5194196 |
Hermetic package for an electronic device and method of manufacturing same |
Dudley A. Chance, David B. Goland |
1993-03-16 |
