JW

Junli Wang

IBM: 18 patents #41 of 6,852Top 1%
EU East China Normal University: 1 patents #3 of 37Top 9%
TE Tessera: 1 patents #22 of 63Top 35%
Overall (2023): #1,984 of 537,848Top 1%
20
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11855191 Vertical FET with contact to gate above active fin Brent A. Anderson, Indira Seshadri, Chen Zhang, Ruilong Xie, Joshua M. Rubin +1 more 2023-12-26
11852582 Automatic photocurrent spectrum measurement system based on fourier infrared spectrometer Liangqing Zhu, Liyan Shang, Le Wang, Zhigao Hu 2023-12-26
11830774 Buried contact through fin-to-fin space for vertical transport field effect transistor Brent A. Anderson 2023-11-28
11817501 Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a wafer Sung-Dae Suk, Somnath Ghosh, Chen Zhang, Devendra K. Sadana, Dechao Guo 2023-11-14
11817497 Vertical field effect transistor inverter with single fin device Ruilong Xie, Alexander Reznicek, Chen Zhang 2023-11-14
11777034 Hybrid complementary field effect transistor device Ruilong Xie, Chen Zhang, Jingyun Zhang, Pietro Montanini 2023-10-03
11764298 VTFET with buried power rails Chen Zhang, Ruilong Xie, Heng Wu, Brent A. Anderson 2023-09-19
11749744 Fin structure for vertical transport field effect transistor Heng Wu, Lan Yu, Dechao Guo, Ruqiang Bao, Ruilong Xie 2023-09-05
11715794 VTFET with cell height constraints Heng Wu, Ruilong Xie, Lan Yu, Alexander Reznicek 2023-08-01
11710666 Dummy fin template to form a self-aligned metal contact for output of vertical transport field effect transistor Brent A. Anderson, Albert M. Young 2023-07-25
11710521 Static random-access memory cell design Lan Yu, Heng Wu, Ruqiang Bao, Dechao Guo 2023-07-25
11695038 Forming single and double diffusion breaks for fin field-effect transistor structures Juntao Li, Kangguo Cheng, Ruilong Xie 2023-07-04
11688635 Oxygen-free replacement liner for improved transistor performance Heng Wu, Dechao Guo, Ruqiang Bao 2023-06-27
11670580 Subtractive via etch for MIMCAP Yann Mignot, Hsueh-Chung Chen, Mary Claire Silvestre, Chi-Chun Liu 2023-06-06
11665877 Stacked FET SRAM design Chen Zhang, Ruilong Xie, Dechao Guo 2023-05-30
11664455 Wrap-around bottom contact for bottom source/drain Alexander Reznicek, Ruilong Xie, Bruce B. Doris 2023-05-30
11658116 Interconnects on multiple sides of a semiconductor structure Albert M. Chu, Dechao Guo, Brent A. Anderson 2023-05-23
11621189 Barrier-less prefilled via formation Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger, Christopher J. Penny, Robert R. Robison +1 more 2023-04-04
11621332 Wraparound contact to a buried power rail Ruilong Xie, Veeraraghavan S. Basker, Alexander Reznicek 2023-04-04
11615988 FinFET devices Veeraraghavan S. Basker, Kangguo Cheng, Theodorus E. Standaert 2023-03-28