Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658116 | Interconnects on multiple sides of a semiconductor structure | Junli Wang, Dechao Guo, Brent A. Anderson | 2023-05-23 |
AC
Albert M. Chu
Overall (2023): #529,511 of 537,848Top 100%
1
Patents 2023