Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11849647 | Nonmetallic liner around a magnetic tunnel junction | Tao Li, Ashim Dutta, Tsung-Sheng Kang, Wenyu Xu | 2023-12-19 |
| 11817389 | Multi-metal interconnects for semiconductor device structures | Hsueh-Chung Chen, Chih-Chao Yang, Shanti Pancharatnam | 2023-11-14 |
| 11804401 | Spacer-defined process for lithography-etch double patterning for interconnects | Nelson Felix, Ekmini Anuja De Silva, Luciana Meli Thompson | 2023-10-31 |
| 11798842 | Line formation with cut-first tip definition | Chanro Park, Koichi Motoyama, Hsueh-Chung Chen | 2023-10-24 |
| 11784120 | Metal via structure | James J. Kelly, Muthumanickam Sankarapandian, Yongan Xu, Hsueh-Chung Chen, Daniel J. Vincent | 2023-10-10 |
| 11688632 | Semiconductor device with linerless contacts | Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy +2 more | 2023-06-27 |
| 11670580 | Subtractive via etch for MIMCAP | Hsueh-Chung Chen, Junli Wang, Mary Claire Silvestre, Chi-Chun Liu | 2023-06-06 |
| 11646358 | Sacrificial fin for contact self-alignment | Indira Seshadri, Su Chen Fan, Christopher J. Waskiewicz, Eric R. Miller | 2023-05-09 |
| 11600325 | Non volatile resistive memory logic device | Hsueh-Chung Chen, Mary Claire Silvestre, Soon-Cheon Seo, Chi-Chun Liu, Fee Li Lie +2 more | 2023-03-07 |
| 11557507 | Via cleaning to reduce resistance | Chih-Chao Yang | 2023-01-17 |