Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670580 | Subtractive via etch for MIMCAP | Yann Mignot, Hsueh-Chung Chen, Junli Wang, Chi-Chun Liu | 2023-06-06 |
| 11600325 | Non volatile resistive memory logic device | Hsueh-Chung Chen, Soon-Cheon Seo, Chi-Chun Liu, Fee Li Lie, Chih-Chao Yang +2 more | 2023-03-07 |
| 11569134 | Wafer backside engineering for wafer stress control | Nikhil Jain, Hsueh-Chung Chen, Hosadurga Shobha | 2023-01-31 |