Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804405 | Method of forming copper interconnect structure with manganese barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2023-10-31 |
| 11756786 | Forming high carbon content flowable dielectric film with low processing damage | Benjamin D. Briggs, Donald F. Canaperi, Huy Cao, Thomas J. Haigh, Jr., Son V. Nguyen +2 more | 2023-09-12 |
| 11756887 | Backside floating metal for increased capacitance | Nicholas Anthony Lanzillo, Huai Huang, Lawrence A. Clevenger | 2023-09-12 |
| 11676854 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo | 2023-06-13 |
| 11621189 | Barrier-less prefilled via formation | Nicholas Anthony Lanzillo, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny, Robert R. Robison +1 more | 2023-04-04 |
| 11569134 | Wafer backside engineering for wafer stress control | Nikhil Jain, Hsueh-Chung Chen, Mary Claire Silvestre | 2023-01-31 |