Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804405 | Method of forming copper interconnect structure with manganese barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2023-10-31 |
| 11557482 | Electrode with alloy interface | Chih-Chao Yang, Chao-Kun Hu, Oscar van der Straten | 2023-01-17 |