Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804405 | Method of forming copper interconnect structure with manganese barrier layer | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2023-10-31 |
| 11749602 | Topological semi-metal interconnects | Ching-Tzu Chen, Nicholas Anthony Lanzillo, Vijay Narayanan | 2023-09-05 |
| 11587830 | Self-forming barrier for use in air gap formation | Benjamin D. Briggs, Elbert E. Huang, Christopher J. Penny | 2023-02-21 |