| 11837501 |
Selective recessing to form a fully aligned via |
Jessica Dechene, Elbert E. Huang, Joe Lee, Theodorus E. Standaert |
2023-12-05 |
| 11790072 |
Paint on micro chip touch screens |
Maryam Ashoori, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo +1 more |
2023-10-17 |
| 11756786 |
Forming high carbon content flowable dielectric film with low processing damage |
Donald F. Canaperi, Huy Cao, Thomas J. Haigh, Jr., Son V. Nguyen, Hosadurga Shobha +2 more |
2023-09-12 |
| 11735524 |
Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones |
Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo |
2023-08-22 |
| 11710658 |
Structure and method to improve FAV RIE process margin and Electromigration |
Joe Lee, Theodorus E. Standaert |
2023-07-25 |
| 11676854 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha |
2023-06-13 |
| 11636353 |
Cognitive system for localized LIDAR pollution detection using autonomous vehicles |
Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo |
2023-04-25 |
| 11587830 |
Self-forming barrier for use in air gap formation |
Elbert E. Huang, Takeshi Nogami, Christopher J. Penny |
2023-02-21 |
| 11586067 |
Structure and method of advanced LCoS back-plane having robust pixel via metallization |
Lan Yu, Tyler Sherwood, Raghav Sreenivasan |
2023-02-21 |
| 11573452 |
Method for LCoS DBR multilayer stack protection via sacrificial hardmask for RIE and CMP processes |
Lan Yu, Tyler Sherwood, Raghav Sreenivasan |
2023-02-07 |
| 11574864 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo |
2023-02-07 |
