HH

Huai Huang

IBM: 3 patents #891 of 6,852Top 15%
TE Tessera: 2 patents #8 of 63Top 15%
📍 Clifton Park, NY: #18 of 141 inventorsTop 15%
🗺 New York: #595 of 11,993 inventorsTop 5%
Overall (2023): #31,680 of 537,848Top 6%
5
Patents 2023

Issued Patents 2023

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
11756887 Backside floating metal for increased capacitance Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger 2023-09-12
11676854 Selective ILD deposition for fully aligned via with airgap Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha 2023-06-13
11621189 Barrier-less prefilled via formation Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny +1 more 2023-04-04
11621199 Silicide formation for source/drain contact in a vertical transport field-effect transistor Heng Wu, Su Chen Fan, Ruilong Xie 2023-04-04
11574864 Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo 2023-02-07