| 11854884 |
Fully aligned top vias |
Nicholas Anthony Lanzillo, Koichi Motoyama, Somnath Ghosh, Christopher J. Penny, Robert R. Robison |
2023-12-26 |
| 11842961 |
Advanced metal interconnects with a replacement metal |
Kisik Choi, Nicholas Anthony Lanzillo, Brent A. Anderson |
2023-12-12 |
| 11830778 |
Back-side wafer modification |
David Wolpert, Daniel James Dechene, Michael Romain, Somnath Ghosh |
2023-11-28 |
| 11823998 |
Top via with next level line selective growth |
Brent A. Anderson, Christopher J. Penny, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2023-11-21 |
| 11812676 |
Multi-terminal phase change memory device |
Timothy Mathew Philip, Kevin W. Brew |
2023-11-07 |
| 11804406 |
Top via cut fill process for line extension reduction |
Christopher J. Penny, Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2023-10-31 |
| 11800819 |
Integrated diode memory device |
Timothy Mathew Philip, Kevin W. Brew |
2023-10-24 |
| 11800817 |
Phase change memory cell galvanic corrosion prevention |
Injo Ok, Nicole Saulnier, Kevin W. Brew, Steven Michael McDermott, Hari Prasad Amanapu +2 more |
2023-10-24 |
| 11790072 |
Paint on micro chip touch screens |
Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Leigh Anne H. Clevenger, Michael Rizzolo +1 more |
2023-10-17 |
| 11791258 |
Conductive lines with subtractive cuts |
Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison |
2023-10-17 |
| 11779918 |
3D nanochannel interleaved devices |
Kangguo Cheng, Donald F. Canaperi, Shawn P. Fetterolf |
2023-10-10 |
| 11756887 |
Backside floating metal for increased capacitance |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Huai Huang |
2023-09-12 |
| 11744981 |
Internet of things (IoT) real-time response to defined symptoms |
Mahmoud Amin, Krishna R. Tunga, Zhenxing Bi, Leigh Anne H. Clevenger |
2023-09-05 |
| 11738995 |
Manipulation of a molecule using dipole moments |
Shawn P. Fetterolf, Donald F. Canaperi, Kangguo Cheng |
2023-08-29 |
| 11735524 |
Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones |
Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo |
2023-08-22 |
| 11682617 |
High aspect ratio vias for integrated circuits |
Nicholas Anthony Lanzillo, Somnath Ghosh, Robert R. Robison |
2023-06-20 |
| 11676854 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Michael Rizzolo, Hosadurga Shobha |
2023-06-13 |
| 11670542 |
Stepped top via for via resistance reduction |
Brent A. Anderson, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2023-06-06 |
| 11670510 |
Self aligned pattern formation post spacer etchback in tight pitch configurations |
Sean D. Burns, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more |
2023-06-06 |
| 11646221 |
Self-aligned pattern formation for a semiconductor device |
Sean D. Burns, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny, Nicole Saulnier |
2023-05-09 |
| 11636353 |
Cognitive system for localized LIDAR pollution detection using autonomous vehicles |
Benjamin D. Briggs, Leigh Anne H. Clevenger, Michael Rizzolo |
2023-04-25 |
| 11621189 |
Barrier-less prefilled via formation |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Christopher J. Penny, Robert R. Robison +1 more |
2023-04-04 |
| 11610941 |
Integrated non volatile memory electrode thin film resistor cap and etch stop |
Kevin W. Brew, Takashi Ando, Michael Rizzolo |
2023-03-21 |
| 11600565 |
Top via stack |
Brent A. Anderson, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2023-03-07 |
| 11574864 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo |
2023-02-07 |
