Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784160 | Asymmetric die bonding | Katsuyuki Sakuma, Shidong Li, Griselda Bonilla | 2023-10-10 |
| 11756911 | Metal pad modification | Ekta Misra | 2023-09-12 |
| 11744981 | Internet of things (IoT) real-time response to defined symptoms | Mahmoud Amin, Lawrence A. Clevenger, Zhenxing Bi, Leigh Anne H. Clevenger | 2023-09-05 |
| 11545444 | Mitigating cooldown peeling stress during chip package assembly | Mukta G. Farooq, Katsuyuki Sakuma, Hilton T. Toy | 2023-01-03 |