HT

Hilton T. Toy

IBM: 1 patents #2,552 of 6,852Top 40%
📍 Hopewell Junction, NY: #22 of 55 inventorsTop 40%
🗺 New York: #4,092 of 11,993 inventorsTop 35%
Overall (2023): #423,066 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11545444 Mitigating cooldown peeling stress during chip package assembly Mukta G. Farooq, Katsuyuki Sakuma, Krishna R. Tunga 2023-01-03