Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848273 | Bridge chip with through via | James J. Kelly | 2023-12-19 |
| 11824037 | Assembly of a chip to a substrate | Katsuyuki Sakuma, Paul S. Andry, Russell Kastberg | 2023-11-21 |
| 11817394 | Semiconductor circuit power delivery | Katsuyuki Sakuma | 2023-11-14 |
| 11791326 | Memory and logic chip stack with a translator chip | Arvind Kumar, Ravi Nair | 2023-10-17 |
| 11682640 | Protective surface layer on under bump metallurgy for solder joining | James J. Kelly | 2023-06-20 |
| 11545444 | Mitigating cooldown peeling stress during chip package assembly | Katsuyuki Sakuma, Krishna R. Tunga, Hilton T. Toy | 2023-01-03 |