Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11850068 | Modular sensing unit | Rajeev Narayanan, Bing Dang | 2023-12-26 |
| 11824037 | Assembly of a chip to a substrate | Mukta G. Farooq, Paul S. Andry, Russell Kastberg | 2023-11-21 |
| 11817394 | Semiconductor circuit power delivery | Mukta G. Farooq | 2023-11-14 |
| 11784160 | Asymmetric die bonding | Krishna R. Tunga, Shidong Li, Griselda Bonilla | 2023-10-10 |
| 11631650 | Solder transfer integrated circuit packaging | — | 2023-04-18 |
| 11545444 | Mitigating cooldown peeling stress during chip package assembly | Mukta G. Farooq, Krishna R. Tunga, Hilton T. Toy | 2023-01-03 |