Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784160 | Asymmetric die bonding | Katsuyuki Sakuma, Krishna R. Tunga, Griselda Bonilla | 2023-10-10 |
| 11756930 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Chris Muzzy, Thomas A. Wassick | 2023-09-12 |
| 11694992 | Near tier decoupling capacitors | Charles L. Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Thomas E. Lombardi +1 more | 2023-07-04 |
| 11569181 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Steve Ostrander, Jon A. Casey, Brian R. Sundlof | 2023-01-31 |