GB

Griselda Bonilla

IBM: 1 patents #2,552 of 6,852Top 40%
📍 Hopewell Junction, NY: #22 of 55 inventorsTop 40%
🗺 New York: #4,092 of 11,993 inventorsTop 35%
Overall (2023): #436,610 of 537,848Top 85%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11784160 Asymmetric die bonding Katsuyuki Sakuma, Krishna R. Tunga, Shidong Li 2023-10-10