Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824037 | Assembly of a chip to a substrate | Katsuyuki Sakuma, Mukta G. Farooq, Russell Kastberg | 2023-11-21 |
| 11791270 | Direct bonded heterogeneous integration silicon bridge | Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort +8 more | 2023-10-17 |
| 11587896 | Transferrable pillar structure for fanout package or interconnect bridge | Joshua M. Rubin, Yang Liu, Steven L. Wright | 2023-02-21 |