Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855191 | Vertical FET with contact to gate above active fin | Brent A. Anderson, Junli Wang, Indira Seshadri, Chen Zhang, Ruilong Xie +1 more | 2023-12-26 |
| 11756957 | Reducing gate resistance in stacked vertical transport field effect transistors | Heng Wu, Chen Zhang, Kangguo Cheng, Tenko Yamashita | 2023-09-12 |
| 11710669 | Precision thin electronics handling integration | John U. Knickerbocker, Bing Dang, Qianwen Chen, Arvind Kumar | 2023-07-25 |
| 11587896 | Transferrable pillar structure for fanout package or interconnect bridge | Yang Liu, Steven L. Wright, Paul S. Andry | 2023-02-21 |
| 11574875 | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers | Steven L. Wright, Lawrence A. Clevenger | 2023-02-07 |
| 11563003 | Fin top hard mask formation after wafer flipping process | Chen Zhang, Tenko Yamashita, Brent A. Anderson | 2023-01-24 |