Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11810893 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | William E. Bernier, Bing Dang, Son K. Tran, Mario J. Interrante | 2023-11-07 | $6,695,000 |
| 11766729 | Molten solder injection head with vacuum filter and differential gauge system | Jae-Woong Nah, Eric P. Lewandowski | 2023-09-26 | $8,116,000 |
| 11710669 | Precision thin electronics handling integration | Bing Dang, Qianwen Chen, Joshua M. Rubin, Arvind Kumar | 2023-07-25 | $11,323,000 |
| 11587860 | Method of forming thin die stack assemblies | Bing Dang, Raymond R. Horton, Joana Sofia Branquinho Teresa Maria | 2023-02-21 | $5,683,000 |
| 11574835 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, Jeffrey D. Gelorme | 2023-02-07 | $6,435,000 |