MI

Mario J. Interrante

IBM: 1 patents #2,552 of 6,852Top 40%
📍 New Paltz, NY: #7 of 17 inventorsTop 45%
🗺 New York: #4,092 of 11,993 inventorsTop 35%
Overall (2023): #341,688 of 537,848Top 65%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11810893 Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection William E. Bernier, Bing Dang, John U. Knickerbocker, Son K. Tran 2023-11-07