Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11810893 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | Bing Dang, John U. Knickerbocker, Son K. Tran, Mario J. Interrante | 2023-11-07 | $6,695,000 |