Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810893 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | William E. Bernier, Bing Dang, John U. Knickerbocker, Mario J. Interrante | 2023-11-07 |