Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11766729 | Molten solder injection head with vacuum filter and differential gauge system | John U. Knickerbocker, Eric P. Lewandowski | 2023-09-26 |
| 11749605 | Hybrid under-bump metallization component | Eric P. Lewandowski, Adinath S. Narasgond | 2023-09-05 |
| 11651973 | Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer | Evan G. Colgan, Robert P. Kuder, II, James L. Speidell, Bucknell C. Webb | 2023-05-16 |
| 11541472 | Ultrasonic-assisted solder transfer | Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro, Da-Yuan Shih | 2023-01-03 |