Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11733170 | Optical sensor system for quantitative colorimetric liquid analysis | Minhua Lu, Vince Siu, Russell A. Budd, Youssef Anthony Asaad | 2023-08-22 |
| 11651973 | Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer | Jae-Woong Nah, Robert P. Kuder, II, James L. Speidell, Bucknell C. Webb | 2023-05-16 |
| 11612889 | Fluidic cavities for on-chip layering and sealing of separation arrays | Joshua T. Smith, Benjamin H. Wunsch | 2023-03-28 |