Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11651973 | Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer | Jae-Woong Nah, Evan G. Colgan, James L. Speidell, Bucknell C. Webb | 2023-05-16 |