Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749605 | Hybrid under-bump metallization component | Jae-Woong Nah, Eric P. Lewandowski | 2023-09-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749605 | Hybrid under-bump metallization component | Jae-Woong Nah, Eric P. Lewandowski | 2023-09-05 |