RH

Raymond R. Horton

IBM: 1 patents #2,552 of 6,852Top 40%
📍 Dover Plains, NY: #1 of 2 inventorsTop 50%
🗺 New York: #4,092 of 11,993 inventorsTop 35%
Overall (2023): #288,514 of 537,848Top 55%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11587860 Method of forming thin die stack assemblies John U. Knickerbocker, Bing Dang, Joana Sofia Branquinho Teresa Maria 2023-02-21