YL

Yang Liu

IBM: 3 patents #891 of 6,852Top 15%
📍 Shanghai, NY: #16 of 66 inventorsTop 25%
Overall (2023): #55,327 of 537,848Top 15%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11791270 Direct bonded heterogeneous integration silicon bridge Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort +8 more 2023-10-17
11602287 Automatically aiding individuals with developing auditory attention abilities Stefania Axo, Mark C. Wallen, Keith J. Miller, Richard Polhemus 2023-03-14
11587896 Transferrable pillar structure for fanout package or interconnect bridge Joshua M. Rubin, Steven L. Wright, Paul S. Andry 2023-02-21