Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848273 | Bridge chip with through via | Mukta G. Farooq | 2023-12-19 |
| 11784120 | Metal via structure | Yann Mignot, Muthumanickam Sankarapandian, Yongan Xu, Hsueh-Chung Chen, Daniel J. Vincent | 2023-10-10 |
| 11682640 | Protective surface layer on under bump metallurgy for solder joining | Mukta G. Farooq | 2023-06-20 |