Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817389 | Multi-metal interconnects for semiconductor device structures | Chih-Chao Yang, Yann Mignot, Shanti Pancharatnam | 2023-11-14 |
| 11798842 | Line formation with cut-first tip definition | Chanro Park, Koichi Motoyama, Yann Mignot | 2023-10-24 |
| 11784120 | Metal via structure | Yann Mignot, James J. Kelly, Muthumanickam Sankarapandian, Yongan Xu, Daniel J. Vincent | 2023-10-10 |
| 11715594 | Vertically-stacked interdigitated metal-insulator-metal capacitor for sub-20 nm pitch | Chih-Chao Yang | 2023-08-01 |
| 11670580 | Subtractive via etch for MIMCAP | Yann Mignot, Junli Wang, Mary Claire Silvestre, Chi-Chun Liu | 2023-06-06 |
| 11600519 | Skip-via proximity interconnect | Yann Mignot | 2023-03-07 |
| 11600325 | Non volatile resistive memory logic device | Mary Claire Silvestre, Soon-Cheon Seo, Chi-Chun Liu, Fee Li Lie, Chih-Chao Yang +2 more | 2023-03-07 |
| 11569134 | Wafer backside engineering for wafer stress control | Nikhil Jain, Mary Claire Silvestre, Hosadurga Shobha | 2023-01-31 |