Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817389 | Multi-metal interconnects for semiconductor device structures | Hsueh-Chung Chen, Yann Mignot, Shanti Pancharatnam | 2023-11-14 |
| 11804378 | Surface conversion in chemical mechanical polishing | Raghuveer R. Patlolla, Donald F. Canaperi, Cornelius Brown Peethala, Mary Breton | 2023-10-31 |
| 11758819 | Magneto-resistive random access memory with laterally-recessed free layer | Oscar van der Straten, Koichi Motoyama, Kenneth Chun Kuen Cheng, Joseph F. Maniscalco | 2023-09-12 |
| 11744083 | Fabrication of embedded memory devices utilizing a self assembled monolayer | Ashim Dutta, Ekmini Anuja De Silva | 2023-08-29 |
| 11735468 | Interconnect structures including self aligned vias | Terry A. Spooner, Koichi Motoyama, Shyng-Tsong Chen | 2023-08-22 |
| 11715594 | Vertically-stacked interdigitated metal-insulator-metal capacitor for sub-20 nm pitch | Hsueh-Chung Chen | 2023-08-01 |
| 11688680 | MIM capacitor structures | Jim Shih-Chun Liang, Baozhen Li | 2023-06-27 |
| 11676894 | Resistance tunable fuse structure formed by embedded thin metal layers | Alexander Reznicek, Miaomiao Wang, Donald F. Canaperi | 2023-06-13 |
| 11676892 | Three-dimensional metal-insulator-metal capacitor embedded in seal structure | Baozhen Li, Huimei Zhou, Nan Jing | 2023-06-13 |
| 11647681 | Fabrication of phase change memory cell in integrated circuit | Baozhen Li, Andrew Tae Kim, Barry P. Linder | 2023-05-09 |
| 11637036 | Planarization stop region for use with low pattern density interconnects | Cornelius Brown Peethala, Hari Prasad Amanapu, Raghuveer R. Patlolla, Koichi Motoyama | 2023-04-25 |
| 11621294 | Embedding MRAM device in advanced interconnects | Ashim Dutta, Saumya Sharma, Tianji Zhou | 2023-04-04 |
| 11600325 | Non volatile resistive memory logic device | Hsueh-Chung Chen, Mary Claire Silvestre, Soon-Cheon Seo, Chi-Chun Liu, Fee Li Lie +2 more | 2023-03-07 |
| 11557482 | Electrode with alloy interface | Daniel C. Edelstein, Chao-Kun Hu, Oscar van der Straten | 2023-01-17 |
| 11557507 | Via cleaning to reduce resistance | Yann Mignot | 2023-01-17 |