Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848264 | Semiconductor structure with stacked vias having dome-shaped tips | Koichi Motoyama, Chanro Park, Alexander Reznicek | 2023-12-19 |
| 11758819 | Magneto-resistive random access memory with laterally-recessed free layer | Oscar van der Straten, Koichi Motoyama, Joseph F. Maniscalco, Chih-Chao Yang | 2023-09-12 |
| 11735475 | Removal of barrier and liner layers from a bottom of a via | Chanro Park, Koichi Motoyama, Nicholas Anthony Lanzillo | 2023-08-22 |