| 11854884 |
Fully aligned top vias |
Koichi Motoyama, Somnath Ghosh, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger |
2023-12-26 |
| 11842961 |
Advanced metal interconnects with a replacement metal |
Lawrence A. Clevenger, Kisik Choi, Brent A. Anderson |
2023-12-12 |
| 11823998 |
Top via with next level line selective growth |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2023-11-21 |
| 11804406 |
Top via cut fill process for line extension reduction |
Christopher J. Penny, Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Robert R. Robison |
2023-10-31 |
| 11791258 |
Conductive lines with subtractive cuts |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Christopher J. Penny, Robert R. Robison |
2023-10-17 |
| 11756887 |
Backside floating metal for increased capacitance |
Hosadurga Shobha, Huai Huang, Lawrence A. Clevenger |
2023-09-12 |
| 11749602 |
Topological semi-metal interconnects |
Ching-Tzu Chen, Vijay Narayanan, Takeshi Nogami |
2023-09-05 |
| 11735475 |
Removal of barrier and liner layers from a bottom of a via |
Chanro Park, Koichi Motoyama, Kenneth Chun Kuen Cheng |
2023-08-22 |
| 11682617 |
High aspect ratio vias for integrated circuits |
Somnath Ghosh, Lawrence A. Clevenger, Robert R. Robison |
2023-06-20 |
| 11670542 |
Stepped top via for via resistance reduction |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2023-06-06 |
| 11621189 |
Barrier-less prefilled via formation |
Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny, Robert R. Robison +1 more |
2023-04-04 |
| 11600565 |
Top via stack |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2023-03-07 |
