| 11854884 |
Fully aligned top vias |
Nicholas Anthony Lanzillo, Koichi Motoyama, Somnath Ghosh, Christopher J. Penny, Lawrence A. Clevenger |
2023-12-26 |
| 11823998 |
Top via with next level line selective growth |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo, Kisik Choi |
2023-11-21 |
| 11804406 |
Top via cut fill process for line extension reduction |
Christopher J. Penny, Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo |
2023-10-31 |
| 11791258 |
Conductive lines with subtractive cuts |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny |
2023-10-17 |
| 11757012 |
Source and drain contact cut last process to enable wrap-around-contact |
Andrew M. Greene, Dechao Guo, Tenko Yamashita, Veeraraghavan S. Basker, Ardasheir Rahman |
2023-09-12 |
| 11682617 |
High aspect ratio vias for integrated circuits |
Nicholas Anthony Lanzillo, Somnath Ghosh, Lawrence A. Clevenger |
2023-06-20 |
| 11670542 |
Stepped top via for via resistance reduction |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo |
2023-06-06 |
| 11621189 |
Barrier-less prefilled via formation |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny +1 more |
2023-04-04 |
| 11600565 |
Top via stack |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo |
2023-03-07 |
