Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854884 | Fully aligned top vias | Nicholas Anthony Lanzillo, Koichi Motoyama, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger | 2023-12-26 |
| 11830778 | Back-side wafer modification | David Wolpert, Daniel James Dechene, Lawrence A. Clevenger, Michael Romain | 2023-11-28 |
| 11815865 | Healthy building dashboard facilitated by hierarchical model of building control assets | Bill Hughley, Sheeladitya Karmakar, Shahajahan Sheikh | 2023-11-14 |
| 11817501 | Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a wafer | Sung-Dae Suk, Chen Zhang, Junli Wang, Devendra K. Sadana, Dechao Guo | 2023-11-14 |
| 11688636 | Spin on scaffold film for forming topvia | Karen E. Petrillo, Cody J. Murray, Ekmini Anuja De Silva, Chi-Chun Liu, Dominik Metzler +1 more | 2023-06-27 |
| 11682617 | High aspect ratio vias for integrated circuits | Nicholas Anthony Lanzillo, Lawrence A. Clevenger, Robert R. Robison | 2023-06-20 |
| 11662115 | Hierarchy model builder for building a hierarchical model of control assets | Bill Hughley, Mayur Salgar, Sheeladitya Karmakar, Shahajahan Sheikh | 2023-05-30 |
| 11599075 | Healthy building dashboard facilitated by hierarchical model of building control assets | Bill Hughley, Sheeladitya Karmakar, Shahajahan Sheikh | 2023-03-07 |