| 11856878 |
High-density resistive random-access memory array with self-aligned bottom electrode contact |
Dexin Kong, Ashim Dutta, Daniel Schmidt |
2023-12-26 |
| 11830807 |
Placing top vias at line ends by selective growth of via mask from line cut dielectric |
Ashim Dutta, Dominik Metzler, John C. Arnold |
2023-11-28 |
| 11810828 |
Transistor boundary protection using reversible crosslinking reflow |
Jing Guo, Indira Seshadri, Jingyun Zhang, Su Chen Fan |
2023-11-07 |
| 11804401 |
Spacer-defined process for lithography-etch double patterning for interconnects |
Nelson Felix, Luciana Meli Thompson, Yann Mignot |
2023-10-31 |
| 11778929 |
Selective encapsulation for metal electrodes of embedded memory devices |
Ashim Dutta, Jennifer Church |
2023-10-03 |
| 11756961 |
Staggered stacked vertical crystalline semiconducting channels |
Tsung-Sheng Kang, Tao Li, Ardasheir Rahman, Praveen Joseph, Indira Seshadri |
2023-09-12 |
| 11751492 |
Embedded memory pillar |
Dexin Kong, Ashim Dutta, Daniel Schmidt |
2023-09-05 |
| 11744083 |
Fabrication of embedded memory devices utilizing a self assembled monolayer |
Ashim Dutta, Chih-Chao Yang |
2023-08-29 |
| 11699592 |
Inverse tone pillar printing method using organic planarizing layer pillars |
Nelson Felix, Praveen Joseph, Ashim Dutta |
2023-07-11 |
| 11688632 |
Semiconductor device with linerless contacts |
Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy +2 more |
2023-06-27 |
| 11688636 |
Spin on scaffold film for forming topvia |
Somnath Ghosh, Karen E. Petrillo, Cody J. Murray, Chi-Chun Liu, Dominik Metzler +1 more |
2023-06-27 |
| 11682558 |
Fabrication of back-end-of-line interconnects |
Chi-Chun Liu, Ashim Dutta, Nelson Felix |
2023-06-20 |
| 11681213 |
EUV pattern transfer using graded hardmask |
Nelson Felix, Luciana Meli Thompson, Ashim Dutta |
2023-06-20 |
| 11621326 |
Vertical field effect transistor with crosslink fin arrangement |
Indira Seshadri, Ruilong Xie, Chen Zhang |
2023-04-04 |
| 11562908 |
Dielectric structure to prevent hard mask erosion |
Tao Li, Tsung-Sheng Kang, Praveen Joseph |
2023-01-24 |
| 11561481 |
Using E0 exposures for track/cluster monitoring |
Cody J. Murray, Christopher F. Robinson, Luciana Meli |
2023-01-24 |
| 11556057 |
Surface treatment of titanium containing hardmasks |
Dario L. Goldfarb, Indira Seshadri |
2023-01-17 |
| 11543751 |
Organic photoresist adhesion to metal oxide hardmasks |
Abraham Arceo de la Pena, Jennifer Church, Nelson Felix |
2023-01-03 |
