JA

John C. Arnold

IBM: 2 patents #1,413 of 6,852Top 25%
Overall (2023): #143,214 of 537,848Top 30%
2
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11830807 Placing top vias at line ends by selective growth of via mask from line cut dielectric Ashim Dutta, Ekmini Anuja De Silva, Dominik Metzler 2023-11-28
11688636 Spin on scaffold film for forming topvia Somnath Ghosh, Karen E. Petrillo, Cody J. Murray, Ekmini Anuja De Silva, Chi-Chun Liu +1 more 2023-06-27